◆ High-performance UV Laser Source: Use diode-pumped UV Laser source with high beam quality, high peak power and short
pulse width, which can achieve “cold “processing that ensures the stability and quality.
◆ Optimized Optical System: Optimized optical transmission system with low power consumption, small focused spot size,
high beam quality to ensure the reliability and consistency of the quality.
◆ High-precision Motion System: Imported high precision linear motion module and control module, ensure the device has high
position accuracy and repeatability.
◆ Machine vision system: With two high resolution CCD cameras, combing self-developed image processing algorithm to ensure
accuracy and efficiency of the processing.
◆ Natural Granite Platform: Natural and massive granite base reduces the inertia vibration of the table during start-up, shut-down
and acceleration. At the same time, it maintains structure size long-term stability.
◆ Software: With intelligent processing platform software-Thetalaser, which is a smart laser micromachining application platform,
user-friendly easy to operate and enabling customized software modules.
◆ Drilling and de-panelizing flexible printed circuit board, rigid printed circuit board, flexible-rigid printed circuit board, and chip
◆ De-panelizing assembled flexible or rigid circuits.
◆ Precisely cutting and scribing ceramics with the thickness within 2.0mm.
◆ Precisely cutting thin copper foil, pressure sensitive adhesive, PP, acrylic sheet, polyimide film, etc.
◆ Precisely cutting ITO thin film, glass, organic thin film, special metal sheet, wafer and sapphire, etc.
◆ Support Roll to Roll Cutting way.(option)
Technical Specifications: (3 Sigma)
|Accuracy of X/Y
|Repeatability of X/Y Axis
|X/Y moving speed
|Laser Repetition Rate
|Input Data Format
||Gerber, DXF, HPGL, Sieb&Meyer, Excellon, PCB
||3Φ,380VAC±10%, 50/60Hz, 15A
|Compressed Air Pressure